Prof. Dr. Mohammad Gharaibeh
Profil
Forschungsthemen5
Aufbau des Zentralinstituts für Islamische Theologie an der Humboldt-Universität zu Berlin
Quelle ↗Förderer: Bundesministerium für Forschung, Technologie und Raumfahrt Zeitraum: 01/2019 - 12/2023 Projektleitung: Prof. Dr. Mohammad Gharaibeh, Prof. Dr. phil. Michael Borgolte
Fortsetzung des Aufbaus des Zentralinstituts für Islamische Theologie an der Humboldt-Universität zu Berlin
Quelle ↗Förderer: Bundesministerium für Forschung, Technologie und Raumfahrt Zeitraum: 01/2024 - 12/2028 Projektleitung: Prof. Dr. Mohammad Gharaibeh
Islam und Digitalität: Medialität, Materialität, Hermeneutik.
Quelle ↗Förderer: Bundesministerium für Forschung, Technologie und Raumfahrt Zeitraum: 01/2024 - 06/2027 Projektleitung: Prof. Dr. Mohammad Gharaibeh
„Kanon und Zensur in der Islamischen Ideen- und Theologiegeschichte“
Quelle ↗Förderer: Bundesministerium für Forschung, Technologie und Raumfahrt Zeitraum: 11/2020 - 10/2021 Projektleitung: Prof. Dr. Mohammad Gharaibeh
Mit dem Propheten ins Gespräch kommen
Quelle ↗Förderer: Bundesministerium für Forschung, Technologie und Raumfahrt Zeitraum: 01/2024 - 06/2027 Projektleitung: Prof. Dr. Mohammad Gharaibeh
Mögliche Industrie-Partner10
Stand: 26.4.2026, 19:48:44 (Top-K=20, Min-Cosine=0.4)
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Publikationen25
Top 25 nach Zitationen — Quelle: OpenAlex (BAAI/bge-m3 embedded für Matching).
International Journal of Environmental Research and Public Health · 131 Zitationen · DOI
The current outbreak of monkeypox (mpox) has become a major public health concern because of the quick spread of this disease across multiple countries. Early detection and diagnosis of mpox is crucial for effective treatment and management. Considering this, the purpose of this research was to detect and validate the best performing model for detecting mpox using deep learning approaches and classification models. To achieve this goal, we evaluated the performance of five common pretrained deep learning models (VGG19, VGG16, ResNet50, MobileNetV2, and EfficientNetB3) and compared their accuracy levels when detecting mpox. The performance of the models was assessed with metrics (i.e., the accuracy, recall, precision, and F1-score). Our experimental results demonstrate that the MobileNetV2 model had the best classification performance with an accuracy level of 98.16%, a recall of 0.96, a precision of 0.99, and an F1-score of 0.98. Additionally, validation of the model with different datasets showed that the highest accuracy of 0.94% was achieved using the MobileNetV2 model. Our findings indicate that the MobileNetV2 method outperforms previous models described in the literature in mpox image classification. These results are promising, as they show that machine learning techniques could be used for the early detection of mpox. Our algorithm was able to achieve a high level of accuracy in classifying mpox in both the training and test sets, making it a potentially valuable tool for quick and accurate diagnosis in clinical settings.
European Journal of Mechanics - A/Solids · 49 Zitationen · DOI
Microelectronics Reliability · 37 Zitationen · DOI
Journal of Energy Storage · 36 Zitationen · DOI
Microelectronics Reliability · 35 Zitationen · DOI
European Journal of Mechanics - A/Solids · 31 Zitationen · DOI
Social Network Analysis and Mining · 30 Zitationen · DOI
27 Zitationen · DOI
In this work a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board and adjusts the excitation frequency to match the resonant frequency. The test setup includes an electrodynamic shaker with a real-time vibration control, resistance monitoring for identifying electrical failures of interconnects, and vibration logging for monitoring changes in the dynamic response of the assembly over time. Reliability tests were performed using both the resonance tracking sinusoidal test method and the traditional fixed-frequency method for assemblies, each consisting of a centrally mounted BGA device assembled with SAC305 solder. These tests show that the resonance tracking method gives more consistent failure times than the fixed frequency method. Failure analysis for the tested devices shows the primary failure mode is trace failure with evidence of solder fatigue. A finite element model, correlated with experimental modal analysis, is shown to accurately estimate the circuit board deflection estimated from the harmonic vibration data. This provides a means of estimating the stresses in the electronic interconnections while for accounting for the variability between test parts. These fine-tuned vibration measurement techniques and related finite element models provide the building blocks for high cycle solder fatigue plots (i.e., S-N curves).
The Journal of Strain Analysis for Engineering Design · 25 Zitationen · DOI
This paper aims to examine the thermomechanical response of sintered silver die attachments in power electronics using finite element analysis (FEA). In this work, several material parameters of the sintered silver bonds are investigated. Additionally, two common solder creep constitutive laws including Anand and Garofalo models are also studied. To ensure the fidelity of the simulation procedures, the finite element (FE) models are first correlated with digital image correlation data. Afterward, the FE models are utilized to examine the influence of the material and creep models on the die attach stresses, strains, and plastic works. The expected fatigue and lifetime predictions of the sintered silver layer are thoroughly discussed, accordingly. The results proved that the die attach layer mechanical response is highly driven by the material parameters and creep modeling procedures considered throughout the simulations. Thus, the resulting fatigue life is evaluated. Finally, a general modeling guideline for simulating thermomechanical response of sintered silver die attachments in power electronics are provided in great detail.
Journal of Electronic Packaging · 24 Zitationen · DOI
In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board and adjusts the excitation frequency to match the resonant frequency. The test setup includes an electrodynamic shaker with a real-time vibration control, resistance monitoring for identifying electrical failures of interconnects, and vibration logging for monitoring changes in the dynamic response of the assembly over time. Reliability tests were performed using the resonance tracking sinusoidal test method for assemblies, each consisting of a centrally mounted ball grid array (BGA) device assembled with 63Sn37Pb and SAC105 solder alloys. These tests show that the resonance tracking method gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate the circuit board deflection estimated from the harmonic vibration data. This provides a means of estimating the stresses in the electronic interconnections while accounting for the variability between test parts. These fine-tuned vibration measurement techniques and related FE models provide the building blocks for high cycle solder fatigue plots (i.e., S–N curves).
Journal of Electronic Packaging · 24 Zitationen · DOI
An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for plate-mounted-on-standoffs boundary conditions scheme was required, and hence described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical solution was used to estimate the most critical solder joint deformations and stresses. Finally, the so developed solution provided an effective tool to examine the effect of several geometric and material configurations of electronic package structure on the fatigue performance of electronic products under mechanical vibration loadings.
Soldering and Surface Mount Technology · 23 Zitationen · DOI
Purpose This paper aims to investigate the fatigue life performance of SAC305 ball grid array solders under combined temperature and harmonic vibration loading conditions. Design/methodology/approach Fatigue tests were performed using a sine dwell with resonance tracking vibration and temperature loading experiment. Finite element stress analysis was also performed to help in understanding the observed failure trends. Findings Fatigue test results showed that the lead-free solders tend to fail quickly in higher temperatures and higher vibration loading test conditions. The failure analysis results revealed that in low temperatures, the solder cracks are initiated and propagated at the package side. However, in high temperatures, the cracks are observed at the board side of the interconnect. In all conditions, the cracks are propagated throughout the intermetallic compound layer. Originality/value In the published literature, there is a lack of data in the area of fatigue assessment of lead-free solders under combined temperature and vibration loadings. This paper provides useful insights into combined thermal/vibration fatigue, i.e. reliability behavior of lead-free solder joint types.
Soldering and Surface Mount Technology · 22 Zitationen · DOI
Purpose This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions. Design/methodology/approach Reliability tests were conducted using a sine dwell with resonance tracking vibration experiment. Finite element simulations were performed to help in understanding the observed failure trends. Findings Reliability results showed that the tin-lead solders out-perform lead-free solders in vibrations loading. Additionally, the LGA solder type could provide a better vibration reliability performance than BGA solders. Failure analysis results showed that in LGAs, the crack is initiated at the printed circuit board side and at the component side in BGAs. In both types, the crack is propagated throughout in the intermetallic compound layer. Originality/value In literature, there is a lack of published data in the comparison between LGA and BGA reliability performance in vibration loadings. This paper provides useful insights in the vibration reliability behavior of the two common solder joint types.
Soldering and Surface Mount Technology · 22 Zitationen · DOI
Purpose This paper aims to present a reliability performance assessment of electronic packages subjected to harmonic vibration loadings by using a statistical factorial analysis technique. The effects of various geometric parameters, the size and thickness of the printed circuit board and component and solder interconnect dimensions on the fundamental resonant frequency of the assembly and the axial strain of the most critical solder joint were thoroughly investigated. Design/methodology/approach A previously published analytical solution for the problem of electronic assembly vibration was adopted. This solution was modified and used to generate the natural frequency and solder axial strains data for various package geometries. Statistical factorial analysis was used to analyze these data. Findings The results of the present study showed that the reliability of electronic packages under vibration could be significantly enhanced by selecting larger and thicker printed circuit boards and thinner and smaller electrical components. Additionally, taller and thinner solders might also produce better reliability behavior. Originality/value The results of this investigation can be very useful in the design process of electronic products in mechanical vibration environments.
Journal of Failure Analysis and Prevention · 20 Zitationen · DOI
Analytical model for the transient analysis of electronic assemblies subjected to impact loading
2018Microelectronics Reliability · 20 Zitationen · DOI
IEEE Transactions on Components Packaging and Manufacturing Technology · 19 Zitationen · DOI
Finite element analysis (FEA) is perhaps the most popular technique used for simulating the thermally induced failures of sintered silver die attachments in power electronics. The accuracy of the stress-strain relationship estimations of power electronics is highly influenced by the material mechanical properties and the creep constitutive models used throughout the simulations. Therefore, the current article aims to investigate several Anand-based material properties of the sintered silver bonds considering several mechanical creep constitutive models effect of thermal fatigue life of sintered silver bonds using extensive 3-D FEA thermomechanical simulations. In this investigation, the FEA models are first correlated with the displacement results of the digital image correlation (DIC) experiments. Furthermore, the effect of the material parameters and creep models on the solder stresses, strains, and inelastic strain energy densities and hence on the lifetime predictions of the die attachment layer is discussed in detail. The results showed that the solder behavior is highly dependent on the material parameters as well as creep modeling. Finally, a detailed discussion on the effect of such discrepancies on the predictions and evaluations of sintered silver die attachments fatigue life is also presented.
Microelectronics Reliability · 19 Zitationen · DOI
Elsevier eBooks · 19 Zitationen · DOI
Microelectronics International · 19 Zitationen · DOI
Purpose One difficultly in building an effective finite element (FE) model of a board-level package is because of complex structure of the printed circuit board (PCB), as it contains copper layers, woven fabrics, plated-through holes and so forth. Therefore, it is often acceptable to obtain equivalent orthotropic material properties and use them in the simulation. This paper aims to provide a research methodology to produce equivalent FE models for board-level electronic packages. Design/methodology/approach In this methodology, the FE models’ data were correlated with experimental modal analysis results in terms of natural frequencies and mode shapes. Statistical factorial analysis was used to examine the electronic assembly material properties effect on the structure’s resonant frequencies. The equivalent material properties of the PCB were adjusted using the optimization tool available in ANSYS software for free boundary conditions. The equivalent FE model was then validated for the fixed boundary conditions. Findings The resultant FE models were in great match with the measured data in terms of resonant frequencies and mode shapes. The so-developed models can be further used in the analysis of the dynamic response of the electronic packages and solder interconnects. Originality/value The current approach provides a sophisticated research methodology to provide high-accuracy FE models of electronic assemblies subjected to vibration. The main value of this approach is to first test the effect of each material property on the package dynamic characteristics before starting the correlation process, then to automate the correlation algorithm using the built-in FE model updating feature available in ANSYS software.
Open Engineering · 18 Zitationen · DOI
Abstract This paper discusses the fundamental natural frequency of a thin elastic rectangular, isotropic and orthotropic, plates with clamped corners. Rayleigh’s method was used to analytically calculate the plate lowest natural frequency. In this solution, the vibration mode shape was assumed in a form that certifies the displacement as well as the rotational boundary conditions of the current problem. Finally, this paper provides useful information for evaluating the natural frequency of a plate with fixed corners with different mass attachments configurations.
The European Physical Journal Plus · 17 Zitationen · DOI
Soldering and Surface Mount Technology · 16 Zitationen · DOI
Purpose There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents. Design/methodology/approach A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models. Findings The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility. Originality/value Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.
Australian Journal of Mechanical Engineering · 15 Zitationen · DOI
In this paper, finite element analysis and response surface methodology (RSM) were used to analyse and study the stress concentration factor (SCF) of a uniaxially loaded isotropic plate with a centrally placed countersunk hole. In this study, the finite element (FE) model was built in ANSYS and employed to generate SCF values. This FE model was first optimised in terms of mesh properties and then validated with literature data. Using RSM, the effect of the plate and countersunk hole geometries, which was implemented by four dimensionless parameters, on the SCF was presented. Additionally, as suggested by RSM and using ordinary least squared method, a high-accuracy second order equation to predict the SCF value based on the non-dimensional geometric factors was formulated. Finally, this paper suggests an optimum plate and countersunk design geometries to minimise the SCF in countersunk holes in isotropic plates.
IEEE Transactions on Components Packaging and Manufacturing Technology · 14 Zitationen · DOI
This paper presents a solution for a symmetrical coupled beam structure loaded by a concentrated force. In this structure, a simply supported beam is coupled to another beam by a thin elastic layer, and the elastic layer can connect either the whole beams or only part of the beams. This solution generalized the previously published solution on a uniform coupling to the case of partial coupling. The solution strategy with governing equations and boundary conditions is discussed, and the solution for a most practical case is given explicitly. The analytical solution is in excellent agreement with the finite element analysis result. Finally, the effect of the key parameters is discussed in detail, with emphasis on its application in structural analysis of printed circuit board assembly in electronic packaging.
Kooperationen6
Bestätigte Forscher↔Partner-Paare aus HU-FIS — Gold-Standard-Positive für das Matching.
Mit dem Propheten ins Gespräch kommen
university
Mit dem Propheten ins Gespräch kommen
university
Mit dem Propheten ins Gespräch kommen
university
Islam und Digitalität: Medialität, Materialität, Hermeneutik.
university
Islam und Digitalität: Medialität, Materialität, Hermeneutik.
university
„Kanon und Zensur in der Islamischen Ideen- und Theologiegeschichte“
university
Stammdaten
Identität, Organisation und Kontakt aus HU-FIS.
- Name
- Prof. Dr. Mohammad Gharaibeh
- Titel
- Prof. Dr.
- Fakultät
- HU-Theologien
- Institut
- Zentralinstitut Berliner Institut für Islamische Theologie (BIT)
- Arbeitsgruppe
- Islamische Ideengeschichte
- Telefon
- +49 30 2093-98097
- HU-FIS-Profil
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- Zuletzt gescrapt
- 26.4.2026, 01:05:09